cathode sputtering
英 [ˈkæθəʊd ˈspʌtərɪŋ]
美 [ˈkæθoʊd ˈspʌtərɪŋ]
阴极溅射（喷镀）
双语例句
- Self-consistent description of a DC hollow cathode discharge and analysis of cathode sputtering
空心阴极直流放电的二维自洽模型描述和阴极溅射分析 - The utility model relates to a semi-circular column magnetic control sputtering cathode, belonging to a sputtering source component of a magnetron sputtering device.
一种半圆柱磁控溅射阴极，属于磁控溅射装置中的溅射源部件。 - Preparation and Characterization of Nanocrystalline Ni-Mo as Cathode Catalyst via RF Magnetron Sputtering
射频磁控溅射制备纳米晶Ni-Mo催化阴极及其表征 - Study of Copper Cathode Sputtering Glow Discharge Operated by High Current and Microsecond Pulsed Mode
铜阴极溅射辉光放电在强短脉冲供电时的发射光谱研究 - The failure mechanisms of the RLG are very complex, but the cathode sputtering and the polluting of the reflector are the most important factors among them.
激光陀螺仪失效机理非常复杂，其中对寿命影响最为重要的因素是阴极溅射和反射镜的污染及损伤。 - The characteristics using parallel plate cathode sputtering gold film
平行板电极阴极溅射金膜的溅射特性 - Cathode Sputtering in a DC Hollow Cathode Discharge
空心阴极放电的阴极溅射分析 - Calculation of growth rate and thickness uniformity of the film deposited by cathode hollow magnetron sputtering
环形磁控溅射成膜生长速率及厚度均匀性研究 - Compared to DC discharge, RF discharge has many advantages, such as low exciting voltage, high efficiency, capable of high speed modulation, no cathode sputtering, high output power, long life, power supply for multi-waveguides, compactness, etc.
与直流放电相比较，射频放电具有激励电压低、效率高、易于快速调制、无阴极溅射、比输出功率高、寿命长、多个波导可共用激励电源、结构紧凑等诸多优点。 - Studies on Cathode Materials by Cathodic Sputtering in a Glow Discharge-Atomic Absorption Spectrometry Having Transient Mode of Atomization
辉光放电、阴极溅射／瞬变原子化原子吸收光谱中阴极材料的研究 - Determination of Cadmium, Chromium, Copper, Iron, Magnesium and Manganese by Graphite Cathode Sputtering in a Glow Discharge-Atomic Absorption Spectrometry Having Transient Mode of Atomization
辉光放电、石墨阴极溅射/瞬变原子化原子吸收光谱测定镉、铬、铜、铁、镁、锰的研究 - While hollow cathode being discharged, migration, diffusion, evaporation and sputtering of reaction products were analyzed.
论述了空心阴极放电时，其内部化学反应生成物的迁移、扩散、蒸发和溅射。 - The surface cleaning action, caused by the cathode sputtering phenomenon in ion bombardment brazing in glow discharge is investigated in this paper.
本文研究了辉光放电离子轰击钎焊时阴极溅射现象对工件表面的净化作用。 - Ta film synthesized in carbon steel substrate by net-shape cathode sputtering method
网状阴极法在碳钢表面沉积钽薄膜 - Research of Multiple Hollow Cathode Sputtering Target and Its Application
多重空心阴极溅射靶及其应用 - It has the characteristic of working on higher pressure and lower voltage and having a high cathode sputtering rate.
它具有工作气压高，维持电压低，阴极溅射率高等特点。 - A discharge model on the sputtering hollow cathode discharge ( SHCD) copper ion laser is established, its characteristics of discharge, sputtering and the particle interaction processes are analysed.
本文祥细分析了溅射型空心阴极放电（SHCD）铜离子激光器的放电、溅射特性和粒子的相互作用过程，建立了放电模型。 - Through analysis we review methods fabricating thin film cathode, including chemical acetate base solution technique, sol-gel method, laser ablation, plasma enhanced chemical vapor deposition, pulsed laser deposition, radio frequency magnetron sputtering deposition, and electrostatic spray deposition.
评论了近年来制备薄膜阴极的方法，包括化学酸基溶解法、溶胶-凝胶法、激光焙烧法、增强型等离子体化学气相淀积法、脉冲激光法、电子束喷射沉积法和射频磁控溅射法。 - The cathode which has the Pt cladding with 0.01 μ m on the graphite made by ion beam sputtering has good comprehensive capability. But graphite without Pt cladding is an acceptable cathode material considering the energy consumption of hydrogen production and the cost of plating Pt.
阴极材料选择石墨载体上离子溅射镀铂，铂层厚度为0.01μm时具有较好的综合性能，但考虑电解反应器的能耗及镀铂成本，阴极可采用无镀层的石墨材料。 - The influence of process conditions on tantalum films properties and thickness, including Ar pressure, cathode current, base pressure of chamber, sputtering time, and so on, were researched. The physical and electrical properties of tantalum film were also studied.
研究了氩气压力、阴极电流、系统本底真空度、溅射时间等工艺条件对钽膜性能及厚度的影响，并对钽膜的物理性能及电学性能进行了研究。 - Extraction of negative ions from a cold cathode panning ion source by sputtering on the surface of solid
冷阴极潘宁离子源通过表面溅射直接引出负离子 - Cathode sputtering behavior of Ni-Cr-Mo-Nb alloy
Ni-Cr-Mo-Nb合金的阴极溅射行为 - Shielding the magnetic field in the cathode of the traditional magnetron sputtering device and introducing a magnet below the substrate, let the magnetic field under the substrate take action during sputtering.
将传统磁控溅射设备阴极内的磁场屏蔽，而在基片下放置一块永磁铁，即在溅射空间加一纵向磁场； - The magnetic field not only affects the discharge characteristics, plasma distribution and cathode sputtering target of the etching rate, but also seriously restricted the target life, target utilization and at the same time affect the stability of the experiment and repeatability during sputtering.
指出了磁场不仅影响着溅射时放电特性、等离子体分布、溅射速率和阴极靶材的刻蚀，而且严重制约了靶的使用寿命和靶材的利用率，同时也影响了实验的稳定性和重复性。 - Reducing reflecting layer, transparent electrode, emitter and cathode in the LCD manufacturing technology are all carried out using sputtering method.
液晶显示器制造工艺中的降低反射层、透明电极、发射极与阴极等均由溅射方法形成。 - Vacuum evaporation, cathode sputtering, molecular beam epitaxy, is physical deposition.
真空蒸发、阴极溅射、分子束外延等属于物理淀积。